Please use this identifier to cite or link to this item: http://hdl.handle.net/11452/22934
Title: Effect of electrolyte pH and Cu concentration on microstructure of electrodeposited Ni-Cu alloy films
Authors: Uludağ Üniversitesi/Fen-Edebiyat Fakültesi/Fizik Anabilim Dalı.
0000-0001-5648-3230
Hacıismailoğlu, Mürşide Şafak
Alper, Mürsel
AAG-8795-2021
AAH-9719-2021
36482867500
7005719283
Keywords: Materials science
Physics
Crystallographic texture
Electrodeposition
Electrolyte pH
Ferromagnetic films
Giant magnetoresistance
Texture formation
Nickel
Multilayers
Inhibition
Growth
Alloys
Atomic force microscopy
Cerium alloys
Concentration (process)
Copper
Critical currents
Electrodeposition
Electrolytes
Ferromagnetic materials
Metallic films
Nickel deposits
pH effects
Power quality
Scanning electron microscopy
Surface morphology
Surface properties
Surface roughness
Textures
Transients
X ray diffraction
X ray diffraction analysis
AFM
Crystallographic textures
Current-time transient
Deposition process
Face centered cubic structure
Ferromagnetic films
Initial depositions
Microstructural analysis
Ni-Cu alloy
pH value
Polycrystalline
Potentiostatic control
Texture degrees
Ti substrates
Copper alloys
Issue Date: 15-Nov-2011
Publisher: Elsevier Science Sa
Citation: Haciismailoglu, M. ve Alper, M .(2011). " Effect of electrolyte pH and Cu concentration on microstructure of electrodeposited Ni-Cu alloy films". Surface & Coatings Technology, 206(6), 1430-1438..
Abstract: Single Ni and Ni-Cu alloy films were electrodeposited on polycrystalline Ti substrates from electrolytes with different pH values under potentiostatic control. The deposition processes of the films were evaluated by the current-time transients recorded during deposition. The analysis of the transients clearly showed that the initial deposition of Ni is affected by the electrolyte pH, while in the Ni-Cu alloys the Cu concentration of the electrolyte is more effective than the electrolyte pH. The microstructural analysis by X-ray diffraction (XRD) indicated that the texture degree in both Ni and Ni-Cu alloy films, which have face-centered cubic (fcc) structure, changes with the electrolyte pH. The surface morphology of the samples was investigated using the scanning electron microscopy (SEM) and atomic force microscopy (AFM). It was observed from SEM and AFM studies that the surface roughness of Ni deposits is not considerably affected by the electrolyte pH, while in Ni-Cu alloy films it changes significantly with both the electrolyte pH and the Cu concentration. Accordingly, the surface roughness of the Ni-Cu alloy films increased as electrolyte pH decreased and Cu concentration increased.
URI: https://doi.org/10.1016/j.surfcoat.2011.09.010
https://www.sciencedirect.com/science/article/pii/S0257897211008851
http://hdl.handle.net/11452/22934
ISSN: 0257-8972
Appears in Collections:Web of Science

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