Please use this identifier to cite or link to this item: http://hdl.handle.net/11452/28957
Title: The effects of low mixing temperature on dough rheology and bread properties
Authors: Uludağ Üniversitesi/Ziraat Fakültesi/Gıda Mühendisliği Bölümü.
Başaran, Ayberk
Göçmen, Duygu
7003927112
55967047900
Keywords: Food science and technology
Dough
Dough mixing
Dough mixing temperature
Bread
Gas retention
Wheat
Fermentation
Mixograph
Storage
Quality
High temperature applications
Mixing
Rheology
Textures
Bread properties
Dough rheology
Low mixing temperatures
Food products
Issue Date: Aug-2003
Publisher: Springer
Citation: Başaran, A. ve Göçmen, D. (2003). “The effects of low mixing temperature on dough rheology and bread properties”. European Food Research and Technology, 217(2), 138-142.
Abstract: In this research, the effects of a low mixing temperature on dough rheology and the quality of bread were investigated. In the experiments, strong flour samples (Type 550), 1.5% salt, 3% of yeast and 1% additive mixture were used and dough samples were mixed at 17°C (low temperature), 23°C (control) and 30°C (high temperature). Five different periods (0, 30, 60, 90 and 120 min) were applied at the bulk fermentation stage. At the final proofing stage, the dough was fermented until it reached a constant height. It was determined that almost every bread from dough samples mixed at 17°C resulted in not only the highest bread volume and bread weight, but also the best texture, elasticity and crumb structure. The results of dough samples mixed at 23°C were worse than those of dough samples mixed at 17°C. The worst results were obtained from dough samples mixed at 30°C (high temperature). As a result, it may be concluded that the quality of bread from dough samples mixed at low temperature (17°C) is superior to those from dough samples mixed at the higher temperatures. Besides these findings, it may also be stated that prolonging the period of bulk fermentation in dough samples mixed at 17°C positively develops baking performances.
URI: https://doi.org/10.1007/s00217-003-0717-0
https://link.springer.com/article/10.1007/s00217-003-0717-0
http://hdl.handle.net/11452/28957
ISSN: 1438-2377
Appears in Collections:Scopus
Web of Science

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