Please use this identifier to cite or link to this item: http://hdl.handle.net/11452/30256
Title: The role of ITO resistivity on current spreading and leakage in InGaN/GaN light emitting diodes
Authors: Sheremet, V.
Genç, M.
Elçi, M.
Sheremet, Nina
Altuntaş, İsmail
Ding, Kai
Avrutin, Vitaliy
Özgür, Ümit
Morkoç, Hadis
Uludağ Üniversitesi/Mühendislik Fakültesi/Elektrik ve Elektronik Mühendisliği Bölümü.
Aydınlı, Atilla
ABI-7535-2020
7005432613
Keywords: Physics
Current spreading
Indium tin oxide
InGaN/GaN multiple quantum well
LED
Transparent conductive electrodes
Efficiency droop
Semiconductors
Contacts
Gallium alloys
Indium alloys
Semiconducting indium compounds
Semiconductor junctions
Semiconductor quantum wells
Tin oxides
Finite conductivity
Current transfer
Indium tin oxide
InGaN/GaN
Ingan/gan lightemitting diodes (LEDs)
Inter-digitated electrodes
Light output power
Light emitting diodes
Issue Date: 8-Aug-2017
Publisher: Elsevier
Citation: Sheremet, V. vd. (2017). ''The role of ITO resistivity on current spreading and leakage in InGaN/GaN light emitting diodes''. Superlattices and Microstructures, 111, 1177-1194.
Abstract: The effect of a transparent ITO current spreading layer on electrical and light output properties of blue InGaN/GaN light emitting diodes (LEDs) is discussed. When finite conductivity of ITO is taken into account, unlike in previous models, the topology of LED die and contacts are shown to significantly affect current spreading and light output characteristics in top emitting devices. We propose an approach for calculating the current transfer length describing current spreading. We show that an inter-digitated electrode configuration with distance between the contact pad and the edge of p-n junction equal to transfer length in the current spreading ITO layer allows one to increase the optical area of LED chip, as compared to the physical area of the die, light output power, and therefore, the LED efficiency for a given current density. A detailed study of unpassivated LEDs also shows that current transfer lengths longer than the distance between the contact pad and the edge of p-n junction leads to increasing surface leakage that can only be remedied with proper passivation.
URI: https://doi.org/10.1016/j.spmi.2017.08.026
https://www.sciencedirect.com/science/article/pii/S0749603617314416
http://hdl.handle.net/11452/30256
ISSN: 0749-6036
Appears in Collections:Scopus
Web of Science

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